Here you will find datasheets for some of the components used in the Atari computer.
The datasheets are organized in the following categories:
Atari Chips
- BLiTTER (Bit-Block Transfer Processor) - Information
- For the GST MCU and GST Shifter of the Atari STE please refer to the STE Hadware Page
- DMA
Complex Components
- WD177X FD Controller - Original Western Digital Data
Sheet, Data
Sheet in text format, Programming information
WD1772 FD Controller by DrCoolZic: My edited version of the specification - Yamaha YM2149 Software Controlled Sound Generator (see also this site )
Simple Components
- NS LM78LXX (voltage regulator used in STE audio) and L78L00 (SGS Equivalent)
- NS DAC0800 DAC0802 (8 bits DAC used in STE audio)
- NS LF147 LF347 (Quad OP AMP used in STE audio)
- NS LMC1992 (Digitally Controlled Stereo Tone and Volume circuit used in STE audio)
- NS MF4 (Lowpass Filter used in STE audio)
Memories
- See also the Atari Memory page
- Memories General Information
- 256K x 1 Memories:MT1259-12, MB81256-12
- 1M x 1 Memories: TC511000AJ10
Memories General Information
Most SIMMs and DRAM chips are specified using a "depth x width" notation. There are DRAM chips of various sizes available on the market, which have different depths and widths as well, and a SIMM can be made up (in general) of any combination of DRAM chips that adds up to the proper depth and width. For example, a 1x9 30-pin 1 MB parity SIMM is typically made up of either 9 * 1Mx1 DRAMs, or 2 * 1Mx4 DRAMs plus 1 * 1Mx1. In both cases, the total memory is the same: 1Mx9. Some of the information presented here comes from here
The following table shows common DRAM manufacturers
Company |
Code on First-Quality Chips |
Fujitsu |
MB plus stylized "F" |
Goldstar |
GM |
Hitachi | HM plus Hitachi logo |
Hyundai | HY |
Micron | MT |
Mitsubishi | M5M plus Mitsubishi logo |
Motorola | MCM plus Motorola logo |
NEC | UPD |
Oki | Oki M5 |
Samsung | KM or SEC |
Siemens | SIEMENS |
Texas Instruments | TI or TMS |
Toshiba | TC or TOSHIBA |
The following table shows the different sizes of DRAM chips commonly used in memory modules, and the different bit widths that each size is typically available in. For each one, the configuration of the chip is shown (depth x width) and then in parentheses, the most commonly found last four digits of the part number found on the chip:
DRAM Size in MB |
1 Bit Width |
4 Bit Width |
8 Bit Width |
16 Bit Width |
0.25 Mbits (256 Kbits) |
256Kx1 (256 or 1256) |
-- |
-- |
-- |
1 Mbits |
1Mx1 (1000 or 1024 |
256Kx4 (4256) |
-- |
-- |
4 Mbits |
4Mx1 (4000 or 4100) |
1Mx4 (4400 or 4001) |
512Kx8 (4800 or 8512) |
256Kx16 (4260) |
16 Mbits |
16Mx1 (6100 or 7100) |
4Mx4 (6400 or 7400) |
2Mx8 (7800 or 2100) |
1Mx16 (6160, 7160 or 8160) |
64 Mbits |
-- |
16Mx4 (!?) |
8Mx8 (4800 or 6000) |
4Mx16 (!?) |
MT1259-12
- Part Number = MT1259-12
- Manufacturer Name = Micron Technology
- Description = General Purpose Dynamic RAM - TTL Compatible I/O
- Number of Words = 256k
- Bits Per Word = 1
- t(acc) Max. (S) = 120n
- tW Min (S) = 230n
- Output Config = 3-State
- P(D) Max.(W) Power Dissipation = 150m
- Nom. Supp (V) = 5.0
- Package = DIP
- Pins = 16
- Military = N
- Technology = NMOS
MB81256-12
- Part Number = MB81256-12
- Manufacturer Name = Fujitsu
- Description = General Purpose Dynamic RAM - Page Mode
- Number of Words = 256k
- Bits Per Word = 1
- t(acc) Max. (S) = 120n
- tW Min (S) = 220n
- Output Config = 3-State
- P(D) Max.(W) Power Dissipation = 1.0
- Nom. Supp (V) = 5.0
- Package = DIP
- Pins = 16
- Military = N
- Technology = NMOS
TC5111000AJ10
- Part Number = TC511000AJ10
- Manufacturer Name = Toshiba
- Description = General Purpose Dynamic RAM - 512 refresh cycle/8ms
- Number of Words = 1M
- Bits Per Word = 1
- t(acc) Max. (S) = 100n
- tW Min (S) = 190n
- P(D) Max.(W) Power Dissipation = 330m
- Nom. Supp (V) = 5.0
- Package = SOJ-20/26
- Pins = 26
- Military = N
- Technology = CMOS